| SMTA China East Conference 2008 | |||||||||||||||||||||||||||||||||||||||
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8-11 April 2008 | ||||||||||||||||||||||||||||||||||||||
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Enquiry and Registration: E-mail to peggy@smta.org
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SMTA China East Technical Conference 2008 |
7th April 2008 (Monday)
| (CE08-CM) | SMTA China Committee Meetings | |
| Venue | Guang Yun Room No.8, 1/F., Shanghai Everbright Convention & Exhibition International Hotel | |
| Time | Topic | Speaker |
| 09:00–12:00 | Board of Directors Meeting (CE08-CM1) |
David Raby President of SMTA President of STI Electronics Inc |
| 12:00–14:00 | Lunch Break | |
| 14:00–15:30 | Executive Committee Meeting (CE08-CM2) |
Abby Tsoi SMTA China President Director of Kasion Automation Ltd |
| 15:30–17:00 | Asian Liaison Meeting (CE08-CM3) |
Charles Bauer, PhD Chair of SMTA International Committee Managing Director of TechLead Inc. |
| 17:00–18:30 | Executive Committee Meeting of SMTA Hong Kong Chapter (CE08-CM4) | Alex Choi President of SMTA Hong Kong Chapter Vice President / General Manager of Vtech Communications Ltd. |
8th April 2008 (Tuesday)
| (CE08-TC1) | Technology Conference | |
| Conference Chairman: Michael Y.F Wong Vice President (Technology) of SMTA Hong Kong Chapter Director-Manufacturing Engineering of Embedded Computing and Power of Emerson Network Power | ||
| Venue | Guang Yun Room No.5, 1/F., Shanghai Everbright Convention & Exhibition International Hotel | |
| Time | Topic | Speaker |
| Session 1 : Materials | ||
| 10:00–10:30 |
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization (CE08-TC1.1) |
Dr. Ningcheng Lee Indium Corporation of American |
| 10:30–11:00 | Is it Really Impossible? Combining Superior Anti-Oxidation and Superior Print (CE08-TC1.2) | Dr. Ningcheng Lee Indium Corporation of American |
| 11:00–11:15 | Coffee Break | |
| Session 2 : Process Development | ||
| 11:15–11:45 | Process Development and Reliability Evaluation for Inline Package on Package (POP) Assembly (CE08-TC1.3) |
Jenson Lee Flextronics International |
| 11:45–12:15 | Process and Reliability Study of Lead-Free Wave Soldering for Large Thick Boards (CE08-TC1.4) |
Jenson Lee Flextronics International |
| 12:15–13:45 | Lunch Break | |
| Session 3 : Reliability Study | ||
| 13:45–14:15 | Defect Structure and Failure Mechanism of PTH Electrodeposits (CE08-TC1.5) | Yunhua Tu Huawei Technologies Ltd |
| 14:15–14:45 | Reliability Impact of Copper-Doped Eutectic Tin-Lead Bump and Its Voiding Upon Flip Chip Assemblies(CE08-TC1.6) | Binghua Pan Delphi Electronics & Safety, Singapore |
| 14:45–15:00 | Coffee Break | |
| 15:00–15:30 | Effect of Process Variations on Solder Joint Reliability for Nickel-Based Surface Finishes (CE08-TC1.7) |
Dr. Kenneth LeeAtotech Asia Pacific Ltd. |
All papers will be presented in Chinese
8th April 2008 (Tuesday)
| (CE08-TC2) | Technology Conference | |
| Conference Chairman Alex Choi President of SMTA Hong Kong Chapter Vice President of Vtech Communications Ltd | ||
| Venue | Guang Yun Room No.6, 1/F., Shanghai Everbright Convention & Exhibition International Hotel | |
| Time | Topic | Speaker |
| Session 1 : Materials | ||
| 10:00–10:30 |
Halogen-Free Debate on Solder Paste: IPC Classification |
James Wang Kester Solder |
| 10:30–11:00 | The Study on the Interfacial Reaction between SnAgCu Solder and Ni(P)/Au,Ni(P)/Pd/Au UBMs (CE08-TC2.2) |
Lilly Tsai Atotech Deutschland GmbH Berlin, Germany |
| 11:00–11:15 | Coffee Break | |
| 11:15–11:45 | Solder Micro-Bumping for 3D SiP and FlipChip (CE08-TC2.3) | Dr. Li Gong SUSS Mircro Tec(Shanghai)Inc. |
| Session 2 : Process Development | ||
| 11:45–12:15 | Discussion on Ball Placement Technology Applied in SMT Industry (CE08-TC2.4) |
May Yan Flextronics Electronics Technology (Suzhou) Co.,Ltd. |
| 12:15–13:45 | Lunch Break | |
| Session 3 : Business Development | ||
| 13:45–14:15 | Managing Electronics Manufacturing Business in China (CE08-TC2.5) | Dr. Koh PacRim Technologies Inc. |
| 14:15–14:30 | Coffee Break | |
| Session 4 : Reliability Study | ||
| 14:30–15:00 | A Compliant and Creep Resistant SAC-AI (Ni) Alloy (CE08-TC2.6) | Dr. Ningcheng Lee Indium Corporation of American |
All papers will be presented in Chinese
| (CE08-TT1) | Certified SMT Engineer Course |
8th April 2008 (Tuesday)
| Venue | Guang Yun Room No.12, 1/F., Shanghai Everbright Convention & Exhibition International Hotel | |
| Time | Topic | Instructor |
| 09:00–17:00 | Certified SMT Engineer Course (Theory) | David Hu |
9th April 2008 (Wednesday)
| Time | Topic | Instructor |
| 09:00–17:00 | Certified SMT Engineer Course (Theory & Examination) | David Hu |
10th April 2008 (Thursday)
| Time | Topic | Instructor |
| 09:00–17:00 | Certified SMT Engineer Course (Examination) | David Hu |
All courses will be presented in Chinese
8th April 2008 (Tuesday)
| (CE08-VD1) | Vendor Conference | |
|
Conference Chairman Conference Chairman | ||
| Venue | 3/F., West Hall of Shanghai Everbright Convention & Exhibition Center | |
| Time | Topic | Speaker |
| 10:00–10:25 |
µAXI–High precision automatic X-ray solder joint inspection technology to meet zero defect quality standards (CE08-VD1.1) |
Zhenhui He Phoenix|x-ray Systems + Services |
| 10:30–10:55 | Exploring the Complementary Technologies of AOI and X-Ray (CE08-VD1.2) | Owen Sit YESTech Inc. |
| 11:00–11:25 | Exploring the Complementary Technologies of AOI and X-Ray (CE08-VD1.3) | Owen Sit YESTech Inc. |
| 11:30–11:55 | The impact of placement quality on SMT manufacturing costs (CE08-VD1.4) | Ying-Feng Lee Assembleon (Hong Kong) Ltd. |
| 12:00–12:25 | The impact of placement quality on SMT manufacturing costs (CE08-VD1.5) | Ying-Feng Lee Assembleon (Hong Kong) Ltd. |
| 12:30–12:55 | Investigation into the Mass Imaging Aspects of 0.3mm Wafer Level Chip Scale Package Solder Paste Deposition (CE08-VD1.6) | Hong Kim Lee DDEK Asia Pacific Pte. Ltd. |
| 13:00–14:00 | Lunch Break | |
| 14:00–14:25 | Technology of PWB with EPAD (Embedded Passive and Active Devices) (CE08-VD1.7) | Qi Shen Panasonic Industrial (China) Co., Ltd. |
| 14:30–14:55 | A Systems Approach to Electronics Cleaning (CE08-VD1.8) |
Tingfeng Ge ZESTRON Asia Pacific |
| 15:00–15:25 | Application for QCT in Lead-Free Testing (CE08-VD1.9) | Robert Wong Beijing Innotronics Technologies Co., Ltd. |
| 15:30–15:55 | New Advances in Flip Chip Underfill Technology for Lead-free Packaging (CE08-VD1.10) | Dr. Larry Wang Lord Corporation |
| 16:00–16:25 | Advanced materials for protection of electronics (CE08-VD1.11) |
Yong Chen ELANTAS Zhuhai CO., Ltd. |
All courses will be presented in Chinese
9th April 2008 (Wednesday)
| (CE08-VD2) | Vendor Conference | |
|
Conference Chairman Conference Chairman | ||
| Venue | 3/F., West Hall of Shanghai Everbright Convention & Exhibition Center | |
| Time | Topic | Speaker |
| 10:00–10:25 |
Integrated Device Programming Solution(CE08-VD2.1) |
Vincent Wu BPM Microsystems Inc. |
| 10:30–10:55 | Optimising Rheology for Package-on-Package Flux Dip Processes (CE08-VD2.2) | William Yu Cookson Electronics-ALPHA |
| 11:00–11:25 | Cleaning 01005 & 0201 Stencils (CE08-VD2.3) | Phil Zhang Kyzen Corporation |
| 11:30–11:55 | "A Current problem" in the Electronic Part Mounting Inspection Process(CE08-VD2.4) | Yoshikuni Suzuki YAMAHA MOTOR CO., LTD. |
| 12:00–12:25 | the presentation of the new production N2 lead free reflow oven V9 (CE08-VD2.5) | Qin Zhong Rehm-Suneast International Ltd. |
| 12:30–12:55 | New Screen Printer for SunEast-HEADⅠ(CE08-VD2.6) | Fanshi Han Sun East Electronic Technology (SZ) Co., Ltd. |
| 13:00–14:00 | Lunch Break | |
| 14:00–14:25 | Obtaining and Controlling Reflow Oven Cooling Rates (CE08-VD2.7) |
Daniel Wei BTU/Kasion Automation Ltd. |
| 14:30–14:55 | Materials and Process Characterization(CE08-VD2.8) | Grant Peterson ECD Inc. |
| 15:00–15:25 | How to manufacture electronic boards without failures (CE08-VD2.9) |
Andrea Ganio SPEA |
| 15:30–15:55 | Technology of PWB with EPAD (Embedded Passive and Active Devices) (CE08-VD2.10) | Qi Shen Panasonic Industrial (China) Co., Ltd. |
| 16:00–16:25 | A Systems Approach to Electronics Cleaning (CE08-VD2.11) |
Tingfeng Ge ZESTRON Asia Pacific |
All courses will be presented in Chinese
10 th April 2008 (Thursday)
| (CE08-VD3) | Vendor Conference | |
|
Conference Chairman Conference Chairman | ||
| Venue | 3/F., West Hall of Shanghai Everbright Convention & Exhibition Center | |
| Time | Topic | Speaker |
| 10:00–10:25 |
Integrated Device Programming Solution (CE08-VD3.1) |
Vincent Wu BPM Microsystems Inc. |
| 10:30–10:55 | Cleaning 01005 & 0201 Stencils (CE08-VD3.2) | Phil Zhang Kyzen Corporation |
| 11:00–11:25 | SIPLACE X4i – New Concepts to Break Through the Speed Myth (CE08-VD3.3) | QiongAn Wang Siemens Electronics Assembly Systems Ltd. |
| 11:30–11:55 | Investigation into the Mass Imaging Aspects of 0.3mm Wafer Level Chip Scale Package Solder Paste Deposition (CE08-VD3.4) | Hong Kim Lee DEK Asia Pacific Pte. Ltd. |
| 12:00–12:25 | Materials and Process Characterization (CE08-VD3.5) | Grant Peterson ECD Inc. |
| 12:30–12:55 | µAXI–High precision automatic X-ray solder joint inspection technology to meet zero defect quality standards (CE08-VD3.6) | Zhenhui He Phoenix|x-ray Systems + Services |
| 13:00–14:00 | Lunch Break | |
| 14:00–14:25 | Optimizing Reflow Profiles for High Volume Manufacturing (CE08-VD3.7) | Jason Chuah BTU/Kasion Automation Ltd. |
| 14:30–14:55 | How to manufacture electronic boards without failures (CE08-VD3.8) |
Andrea Ganio SPEA |
| 15:00–15:25 | Exploring the Complementary Technologies of AOI and X-Ray (CE08-VD3.9) | Owen Sit YESTech Inc |
| 15:30–15:55 | Exploring the Complementary Technologies of AOI and X-Ray (CE08-VD3.10) | Owen Sit YESTech Inc. |
| 16:00–16:25 | Reducing the Chance of Thermally-Induced EOS Failures on Your PCBA (CE08-VD3.11) | Agilent Technologies Singapore (Sales) Pte Ltd |
All courses will be presented in Chinese
9th April 2008 (Wednesday)
| (CE08-AD) | SMTA China Annual Dinner | |
| Venue | Banquet Hall, 2/F., Shanghai Everbright Convention & Exhibition International Hotel | |
| Time | Event | |
| 17:00–21:00 | SMTA China Annual Dinner | |
