产品信息:

销售在日本名列前茅的田村成立于1924年，一直致力电子领域，在焊锡技术方面具有极丰富经验。在益发重视环境绿化的今日，田村研发出深具环保意义的无铅焊锡系统。

新产品信息:

N2 Reflow TNP25-538EM

Newly designed, heating application for 8 zone (5 preheating and 3 reflow) profile construction has realized more detailed time setting for different reflow peak temperature.

The compactly designed profile will be applicable to the parts weak in heat resistance, and also multi-control of heating temperatures will provide sufficient heating time to assure good quality of solder ability.

This industry's first introduced system!!
PC operational Windows XP Embedded application.
Hyabridization with PC and the touch panel.
PC-less operation system established. HDD-less function introduced.