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SMTA China South Technical Conference |
26th August 2008 (Tuesday)
| (CS08-TC1) | Technology Conference | |
| Conference Chairman: Michael Y.F Wong Vice President (Technology) of SMTA Hong Kong Chapter Director-Manufacturing Engineering of Embedded Computing and Power of Emerson Network Power | ||
| Venue | Room No.312, 3/F., Shenzhen Convention & Exhibition Center, Shenzhen, China | |
| Time | Topic | Speaker |
| Session 1 | ||
| 10:00–10:30 |
Future Lead-Free Solder Alloys and Fluxes–Meeting Challenges of Miniaturization (CS08-TC1.1) |
Dr. Ningcheng Lee Indium Corporation of American |
| 10:30–11:00 | Discussion on Ball Placement Technology Applied in SMT Industry (CS08-TC1.2) | May Yan Flextronics Electronics Technology (Suzhou) Co.,Ltd. |
| 11:00–11:15 | Coffee Break | |
| Session 2 | ||
| 11:15–11:45 | Effective Parts Library Management System Across Multiple Machine Vendor Platforms (CS08-TC1.3) | Allen Tseng Valor Computerized Systems (Shenzhen) Co., Ltd. |
| 11:45–12:15 | Conduction Soldering: Facts, Fiction and Best Practices (CS08-TC1.4) | Paul Wood OK International |
| 12:15–13:45 | Lunch Break | |
| Session 3 | ||
| 13:45–14:15 | Cleanliness Requirements Prior to Conformal Coating (CS08-TC1.5) | Tony Ge ZESTRON Asia Pacific |
| 14:15–14:45 | Non-Destructive Techniques for Identifying Crack Defect in BGA Joints: TDR, 2DX, and Cross-section/SEM Comparison (CS08-TC1.6) | Sea Tang Flextronics International |
| 14:45–15:00 | Coffee Break | |
| Session 4 | ||
| 15:00–15:30 | Qualification of A Lead-Free Card Assembly & Test Process for A Server Complexity PCBA (CS08-TC1.7) | PK Pu IBM CPC |
| 15:30–16:00 | Defect Structure and Failure Mechanism of PTH lectrodeposits (CS08-TC1.8) | Danny Tu Huawei Technologies Ltd |
| 16:00–16:30 | Advanced Coatings For Electronics Applications –Corrosion Resistant Coatings for Circuit Boards (CS08-TC1.9) | Sunny Mu/Marco Mui Cookson Electronics-Enthone |
All papers will be presented in Chinese
26th August 2008 (Tuesday)
| (CS08-TC2) | Technology Conference | |
| Conference Chairman Xin Zhou Vice President (Technology) of SMTA China Expert of Electronics Manufacture & Assembly of Huawei Technologies Co., Ltd. | ||
| Venue | Room No.314, 3/F., Shenzhen Convention & Exhibition Center, Shenzhen, China | |
| Time | Topic | Speaker |
| Session 1 | ||
| 10:00–10:30 |
Halogen-Free Debate on Solder Paste: IPC Classification and Application (CS08-TC2.1) |
Christine Poon Kester Solder |
| 10:30–11:00 | Is it Really Impossible? Combining Superior Anti-Oxidation and Superior Print (CS08-TC2.2) | Dr. Ningcheng Lee Indium Corporation of American |
| 11:00–11:15 | Coffee Break | |
| Session 2 | ||
| 11:15–11:45 | Managing Electronics Manufacturing Business in China (CS08-TC2.3) | Dr. Koh PacRim Technologies Inc. |
| 11:45–12:15 | Process Development and Reliability Evaluation for Inline Package on Package (POP) Assembly (CS08-TC2.4) | Jenson Lee Flextronics International |
| 12:15–13:45 | Lunch Break | |
| Session 3 | ||
| 13:45–14:15 | Process and Reliability Study of Lead-Free Wave Soldering for Large Thick Boards (CS08-TC2.5) | Jenson Lee Flextronics International |
| 14:15–14:45 | Materials and Process Optimization for High Reliability Lead-Free Soldering (CS08-TC2.6) | Andy Yuen Cookson Electronics-ALPHA |
| 14:45–15:00 | Coffee Break | |
| Session 4 : Reliability Study | ||
| 15:00–15:30 | EPD Display Manufacturing-A Sleek & Effective Solution (CS08-TC2.7) | Tonny Tong Flextronics Zhuhai Campus |
| 15:30–16:00 | The Art of Repeating Profiling in Reflow Soldering Process (CS08-TC2.8) | K.S Seet KIC Inc. |
All papers will be presented in Chinese
27th August 2008 (Tuesday)
| (CS08-TC3) | Technology Conference | |
| Conference Chairman Michael Y.F Wong Vice President (Technology) of SMTA Hong Kong Chapter Director-Manufacturing Engineering of Embedded Computing and Power of Emerson Network Power | ||
| Venue | Room No.312, 3/F., Shenzhen Convention & Exhibition Center, Shenzhen, China | |
| Time | Topic | Speaker |
| Session 1 | ||
| 10:00–10:30 |
A Compliant and Creep Resistant SAC-AI (Ni) Alloy (CS08-TC3.1) |
Dr. Ningcheng Lee Indium Corporation of American |
| 10:30–11:00 | Building A Global Technologically Efficient Supply Chain (CS08-TC3.2) | LH Chew IBM Corporation |
| 11:00–11:15 | Coffee Break | |
| Session 2 | ||
| 11:15–11:45 | Stacking Technique of Fully Wafer Level Process without Thru-Silicon VIA-Commercial Applications (CS08-TC3.3) | Dr. Christian M. VAL 3D PLUS |
| 11:45–12:15 | Solder Micro-Bumping for 3D SiP and FlipChip (CS08-TC3.4) | Dr. Li Gong SUSS Mircro Tec (Shanghai) Inc. |
| 12:15–13:45 | Lunch Break | |
| Session 3 | ||
| 13:45–14:15 | Mixed Assembly Technology-Challenges & Solutions (CS08-TC3.5) | Jojo Vigo Flextronics Zhuhai Campus |
| 14:15–14:45 | How to bring X-ray Microfocus Computed Tomography (μCT) from Lab to the Production Floor? (CS08-TC3.6) |
Friedhelm Maur YXLON Feinfocus, Shanghai |
| 14:45–15:00 | Coffee Break | |
| Session 4 | ||
| 15:00–15:30 | A Study of 0201's and Tombstoning in Lead-Free Systems (CS08-TC3.7) | Jackson Chan Cookson Electronics-ALPHA |
| 15:30–16:00 | The Path of Taking High Reliability Products to Lead-Free (CS08-TC3.8) | Xiaodong Jiang Alcatel Shanghai Bell Co Ltd. |
All papers will be presented in Chinese
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