Company Info:

Hesse & Knipps GmbH develops and delivers customer specific equipment for the back-end semi conductor industry: bonders, ultrasonic flip-chip systems and special systems right up to complete production lines.
We offer solutions for thin and heavy wire wedge-bond applications ranging from 12.5um to 500um wire diameters. The BJ820 is designed for thin-wire applications, it can bond aluminum, gold or copper wire, in both wire or ribbon configuration. Machine is able to bond at 40um fine pitch capability, has quality control by wire deformation, a near maintenance-free bond-head and a 305mm x 410mm huge work area.

New Product:

The BJ915L is a dual-head heavy wire bonder automated with an indexer for power discrete applications like TO and D-Pak. The system is equipped with an anti-vibration mechanism, E-box, active cutter and a real-time bond quality monitoring system and dual cameras.

BJ915L