New Product Info:

SOLDERCOAT GTSLF219C (Sn/Ag3.0/Cu0.5) LEAD FREE SOLDER PASTE
GTSLF219C is a special solder paste which coating is applied to the solder powder. It can improve the wettability at the high resistant preheating temperature. By preventing oxidization of solder powder, the activator for oxidation-reduction can be reduced. For the advantage of high resistant preheating temperature, GTSLF219C is highly recommended using to reduce the problem of BGA void.

SOLDERCOAT MTLF225 (Sn/Ag0.3/Cu0.7) LEAD FREE SOLDER PASTE
As the metal price increases rapidly in the previous years, especially Silver Ag (from US$ 250 / KG to US$ 680 / KG). Compare with the traditional lead free solder paste Sn/Ag3.0/Cu0.5, MTLF225 is a very good product for cost down because of the lower Silver Ag content. MTLF225 has a very good wettability and printability. MTLF225 can be used on 0.4mm fine pitch or BGA.