Product Info:

Indium8.9 Pb-Free Solder Paste delivers more performance than any Pb-Free solder paste ever made. Finally, a Pb-free solder paste that performs like SnPb. Designed for CSP, 0201, and 01005 technologies, it has excellent print-transfer properties and consistent print volumes through apertures below the industry recommended minimum area ratio of 0.66.

From cell phones to Mother Boards ¨C Indium8.9 does it all. Indium8.9 exhibits low voiding (<5%) over many different profiles when soldering BGAs with via-in-pad technology. It also offers a very robust processing window that can minimize potential defects, as well as accommodate various board sizes and throughput requirements.

Indium8.9 eliminates "head-in-pillow" defects when mounting BGA devices and its excellent wetting improves your product's first-pass yields and reduces field failures. The performance benefits customers obtain by using Indium8.9 result in increased cost savings and the highest finished goods reliability.