 | Henkel Loctite (China) Co., Ltd Product Name:Multicore® LF 600 / Loctite® 3536 Booth No:1A20 WebSite:www.henkel.com/electronics |
| Multicore® LF600 is a new generation lead-free solder paste from Henkel.With superior performance over a wide range of reflow profiles and long abandon time capabilities, Multicore® LF600 gives assemblers of advanced electronic devices ( eg. Mobile phone, PDA and laptop and or so) the requirement on printability, reliability and efficiency . Multicore® LF600 also provides an outstanding tack force to resist component movement during high speed placement, allows a fast print speed with low print pressure to minimize board warpage and helps lower manufacturing costs and maximizes production efficiencies. In addition to its exceptional superior humidity resistance performance, Multicore® LF600 also avoids the solder ball producing effectively.
Multicore® LF 600
Henkel Corporation has engineered a fast cure and reworkable underfill material for BGA and CSP devices-- Loctite® 3536. Henkel's Loctite 3536 remain the best option for drop-test protection of BGAs and CSPs used in modern handheld devices, the excellent reworkability succeed avoiding the loss on rework process due to the design or technical fault. Henkel's Loctite 3536 material is the most cost-effective solution for packages.
Loctite® 3536
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