PVA850
PVA has unveiled the next generation of high speed semiconductor packaging dispense systems with the PVA850. Touting speed and accuracy capability unique to the adhesive dispensing industry, the PVA850 will provide throughput and flexibility unlike any rival. PVA¡¯s robust gantry design can accommodate multiple dispense heads and requires no periodic positional calibration. The PVA850 is ideally suited for any underfill, glob top, dam and fill, wire bond, or die attach dispensing process where high speed, accuracy, and flexibility are of the highest demand.

Yestech X-3
YESTech's versatile X-Series Automated X-RayInspection Systems ( AXI ) offer complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCB's and packaged semiconductors. Ideal for in-line or off-line operation, the X-Series' innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information. The X-3 3-D system permits users to discriminate between the top and bottom sides of boards where there is a high-density of solder joints. YESTech's 3-D capability separates the top and bottom images of double sided boards for unimpeded automated inspection of solder joints.