NEPCON/ EMT South China will again host a series of conference and seminar programs by SMTA China South.
This timely event will address the industry's most pressing issues concerning electronics manufacturing, advanced packaging and lead-free reliability. Topics covered including 01005 assembly, 3D SiP (System in Package), PoP (Package on Package), Pb Free Reliability, Component Supply Integrity, Legal responsibility of non-RoHS part/product entering Europe and Flex Circuit Assembly
Click here for conference programs. |