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Dear
NEPCON / EMT China 2008 will be held in Shanghai Everbright Convention and Exhibition Center next Tuesday. See exciting new products and attend Vendor Conference at the event.
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MYDATA automation, Shanghai/Dongguan
MYDATA Booth no.: 1A02
MY100DX-14
With the state-of-the-art placement machine MY100, flexibility has got a whole lot faster. The MY100 is the perfect all-in-one solution wherever high volumes of high-mix production are anticipated. It features two linear drive mounthead carriers that are equipped with high-speed multi-nozzle heads and high-precision single-nozzle heads for maximum flexibility. An advanced vision system centers components before mounting allowing you to mount a wide range of components in terms of size and complexity at high speed.
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| 8th April 2008 (Tuesday) | |||||
| Time | Topic | Speaker | |||
| 10:00 - 10:25 | µAXI ¨C High precision automatic X-ray solder joint inspection technology to meet zero defect quality standards | Zhenhui He Phoenix|x-ray Systems + Services |
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| 10:30 - 11:25 | To be confirmed | YESTech | |||
| 11:30 - 12:25 | The impact of placement quality on SMT manufacturing costs |
Ying-Feng Lee Assembleon (Hong Kong) Ltd. |
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| 12:30 - 12:55 | Investigation into the Mass Imaging Aspects of 0.3mm Wafer Level Chip Scale Package Solder Paste Deposition | Hong Kim Lee DEK Asia Pacific Pte. Ltd. |
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| 14:00 - 14:25 | Technology of PWB with EPAD |
Qi Shen Panasonic Industrial (China) Co., Ltd. |
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| 14:30 - 14:55 | A Systems Approach to Electronics Cleaning | Tingfeng Ge, ZESTRON Asia Pacific | |||
| 15:00 - 15:25 | Application for QCT in Lead-Free Testing | Robert Wong Beijing Innotronics Technologies Co., Ltd. |
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| 15:30 - 15:55 | New Advances in Flip Chip Underfill Technology for Lead-free Packaging | Dr. Larry Wang Lord Corporation |
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| 16:00 - 16:25 | Advanced materials for protection of electronics | Yong Chen, ELANTAS Zhuhai CO., Ltd. | |||
| 9th April 2008 (Wednesday) | |||||
| 10:00 - 10:25 | ntegrated Device Programming Solution | Vincent Wu, BPM Microsystems Inc. | |||
| 10:30 - 10:55 | Optimising Rheology for Package-on-Package Flux Dip Processes | William Yu Cookson Electronics-ALPHA |
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| 11:00 - 11:25 | Cleaning 01005 & 0201 Stencils | Phil Zhang, Kyzen Corporation | |||
| 11:30 - 11:55 | ¡°A Current problem¡± in the Electronic Part Mounting Inspection Process | Yoshikuni Suzuki YAMAHA MOTOR CO., LTD. |
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| 12:00 - 12:25 | the presentation of the new production N2 lead free reflow oven V9 | Qin Zhong Rehm-Suneast International Ltd. |
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| 12:30 - 12:55 | New Screen Printer for SunEast-HEAD | Fanshi Han Sun East Electronic Technology (SZ) Co., Ltd. |
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| 14:00 - 14:25 | Obtaining and Controlling Reflow Oven Cooling Rates | Daniel Wei BTU/Kasion Automation Ltd. |
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| 14:30 - 14:55 | Materials and Process Characterization | Grant Peterson, ECD Inc. | |||
| 15:00 - 15:25 | How to manufacture electronic boards without failures | Andrea Ganio, SPEA | |||
| 15:30 - 15:55 | Technology of PWB with EPAD |
Qi Shen Panasonic Industrial (China) Co., Ltd. |
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| 16:00 - 16:25 | A Systems Approach to Electronics Cleaning | Tingfeng Ge, ZESTRON Asia Pacific | |||
| 10th April 2008 (Thursday) | |||||
| 10:00 - 10:25 | Integrated Device Programming Solution Vincent | Wu, BPM Microsystems Inc. | |||
| 10:30 - 10:55 | Cleaning 01005 & 0201 Stencils | Phil Zhang, Kyzen Corporation | |||
| 11:00 - 11:25 | SIPLACE X4i ¨C New Concepts to Break Through the Speed Myth | QiongAn Wang Siemens Electronics Assembly Systems Ltd. |
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| 11:30 - 11:55 | Investigation into the Mass Imaging Aspects of 0.3mm Wafer Level Chip Scale Package Solder Paste Deposition | Hong Kim Lee DEK Asia Pacific Pte. Ltd. |
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| 12:00 - 12:25 | Materials and Process Characterization | Grant Peterson , ECD Inc. | |||
| 12:30 - 12:55 | Reducing the Chance of Thermally-Induced EOS Failures on Your PCBA | Agilent Technologies S'pore(Sales)Pte Ltd | |||
| 14:00 - 14:25 | Obtaining and Controlling Reflow Oven Cooling Rates | Daniel Wei, BTU/Kasion Automation Ltd. | |||
| 14:30 - 14:55 | How to manufacture electronic boards without failures | Andrea Ganio, SPEA | |||
| 15:00 - 15:55 | To Be Confirmed | YESTech | |||
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