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SMTA China South Conference 2008 | ||||||||||||||||||||||||||||||||||||||||||||||||
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The SMTA China will organize the SMTA China South Conference 2008 in Shenzhen on 26-30 August, 2008. This timely event will be held in conjunction with NEPCON South China and will address the industry's most pressing issues concerning electronics manufacturing, advanced packaging and lead-free reliability.
Technology Conference/Vendor Conference Topics (26-28 August 2008)
- 01005 Assembly
- 3D SiP (System in Package)
- Challenges of PCB Fabrication Technology and Surface Finish Component Supply Integrity
- Cost Reduction Initiative
- Advanced Low I/O Packaging
- Flex Circuit Assembly
- Market Trends in Assembly Manufacture
- Manufacturing Engineering
- Materials and Process Characterizatio
- Pb Free Processes and Product Reliability PoP (Package on Package)
- Process Control Excellence
- Production and Supply Chain Management RoHS Compliance and Materials
- Risk Free Rework/Repairing
- State of Art Inspection and Failure Analysis
SMT Engineer Certification (26-28 August 2008)
SMTA Engineer Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes. The program concludes on days two and three with an open and closed book examination.
This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes
Enquiry and Registration: E-mail to peggy@smta.org
