Mobile Phone Industry Chain Summit 2017: Materials & Components

Organized by:

Sponsor:

Supporter:

Time:
Place:

26-27th April 2017
Shanghai Expo. Exhibition.,NEPCONTheatre

Agenda

26th April

Forum1:Mobile Phone Manufacturing Material Forum

09:30-10:00

Registration

10:00-10:05

Welcome
Speaker: Yi Zhiquan
Taichen Corporate(Taiwan•Jiangxi) Co.,Ltd, President

10:05-10:30

Opening Address

10:30-10:55

Topic: Evolution in Handset Shell Design Trend and Materials

Speaker: Cheng Yaning
Coolpad, Senior CMF Engineer

10:55-11:35

Topic: μm-Aerosol Spray Printing Technology that drives 3D Printed Circuit Development (Manufacturing of Handset Antennas and Sensors)
Speaker:James Q. Feng, Ph.D.
Principal Engineer ,Optomec  

11:35-12:00

Topic: The effect of spherical solder powder on welding of SMT.
Speaker:Zhongying
Yunnan Tin Company Limited
Sales Manager

12:00-13:30

Lunch and break

13:30-13:40

MC’s Remarks-Afternoon Session Begins

13:40-14:05

Topic: Smartphones: Development Trends and Market Competition Landscape
Speaker: Yuan  Shuangqiang
SOP Group, Deputy General Manager 

14:05-14:45

Topic: Research on New Energy-Saving High-Intensity Low-Temperature Pb-free Welding   

Materials and Related Applications

14:45-15:15

Topic: Current Applications of the Smartphone Waterproofing Process and Waterproof Material Market Analysis

Speaker: He Hui
Gomtel , R&D Director

15:15-15:35

Topic: Defect analysis and Countermeasures of HIP and NWO

Speaker: Xin Ma
R&D Director 
ZHONGSHAN HANHUA TIN CO., LTD.,

15:35-16:30

Panel Discussion

Host: Yi Zhiquan
President ,Taichen Corporate(Taiwan•Jiangxi) Co.,Ltd,
Speaker: Cheng Yaning; Zhongyin; Yuan Shuangqiang; He Hui

27th April

Forum2:Components Forum

09:15-09:45

Registration

09:45-10:00

Host Speech

10:00-10:20

Topic: 2017 Global Top 10 Smartphone players Market trend and prediction

Speaker:James Yan,
Counterpoint Technology Market Research, Head of Greater China/Research Director

10:20-10:40

Topic: Smartphone Feature Key Component Trends
Speaker: Jeff Fieldhack
Counterpoint Technology Market Research

10:40-11:00

Topic: 3D NAND technology leads us to a new era
Speaker: Western Digital Corporation,
 Product Marketing Manager

11:00-11:20

Topic: The Development & Innovation of 5G chip

Speaker: Linda Xiao
Business Development Director

11:20-11:40

Topic: China ODM development and demand for components
Speaker: YeHua
Wingtech Mobile Communications Co.,Ltd, Chief Engineer

*The Final schedule pf all on-site activities is subject to change (http://www.smthome.net

Contact: Gina Li Reed Exhibitions

Tel: +86 10 5763 1812 Fax: +86 10 8518 8016

Emai: haibin.li@reedexpo.com.cn

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