SMTA China East Conference 2017

01 Dec 2016 08:00

SMTA China East Conference 2017



24-27 April 2017
Shanghai World Expo Convention &
Exhibition Center, China

SMTA China East Conference 2017 Program

 
24 April
(Tuesday)
25 April
(Wednesday)
26 April
(Thursday)
27 April
(Friday)

Technology Workshop

09:00-17:00
     

Technology Conference

 
10:15-16:00
10:15-16:00
 

Vendor Conference

 
10:30-15:30
10:30-12:30

SMTA China Annual Award Presentation

 
15:30-16:00
   

Trade Show

 
NEPCON China 2017

The SMTA China will organize the SMTA China East Conference 2017 in Shanghai on 25-27 April, 2017. This timely event will be held in conjunction with NEPCON China 2017.  This events will as usual address the industry’s most pressing issues in electronics assembly/ manufacturing, industry/ technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.

Technology Conference/Vendor Conference Topics (25-27 April 2017)

Topical coverage includes:
Advanced Packaging/ Components: 2.5/3D Packaging and Integration,BGA/CSP,Biomedical Packaging,Component Storage,Connector Technology,Copper Pillars,Copper Wire Bonding,Diffusion Bonding,Embedded and Miniature Passives,Environmental Testing,Failure Analysis Techniques,Flip Chip,High Temperature Packaging,Lead Finishes,Magnetic Soldering,MEMS and Sensors,Moisture Sensitive Devices (MSD),Package on Package (PoP),Photonics,Photovoltaics and Solar,Reliability,Silver Wire-bonding,Stacked Die,System in Package (SiP),Through Silicon Vias (TSVs),Tin Whiskers,Wafer Level Packaging (WLP)

Assembly: 01005/03015 Components/Assembly,3D Board Assembly,Additive Manufacturing,SMT Adhesives,Alternate Solder Alloys,BGA/CSP Assembly,Bottom Terminated Components,Cavity Board Assembly,Cleaning, Conformal Coating and Potting,Connector Assembly to PCB,DFX/Design for Six Sigma,Direct Chip Attach to PCB (DCA),Dispensing & Underfill,Epoxy Fluxes,Facility Layout,Halogen and Halogen-Free,Head on Pillow Defect/Warpage Induced Solder Joint Defects,High Melting Point Solder,Laser Soldering,Leadless Area Array Packages,Lead-Free Soldering/Reliability,Low Temperature Processing,Low Volume/Prototype,Non-Wet Open (NWO) Defects,Package-on-Package Assembly,Part Obsolescence,Placement,Printing,Reflow Soldering/ Wave Soldering,Rework and Repair of QFNs (01005,Leadless Components, PoP),Rework Reliability,Robotic Soldering,Selective Soldering,Solder Jetting,Solder Paste/Solder Voids in Joints,Solderless Interconnections,Supplier Engineering,Thermo Compression Bonding,Underfill/ Corner Glue/ Other Polymeric Reinforcements,Vapor Phase Reflow,Yield Improvement

Business/Supply Chain: Capacity Modeling,Conict Minerals,Contract Manufacturing,Counterfeit Parts,Doing Business in Overseas,Environmental Issues,Lean Manufacturing,Onshoring,Operations Management,Part Obsolescence,RoHS/REACH Compliance,Supplier Management,Technology Roadmaps

Emerging Technologies: <= 0.3mm Pitch Area Array Technologies,3D Circuits,3D Printing & Design Rules,Advanced Packaging,Assembly to Flex Substrates,Assembly to Glass Substrates,Cavity Assembly,Consumer Applications,Embedded Active Technology,Embedded Passive Technology,Flexible Electronics,High Frequency,Jetting of Solder Pastes,LED Technology/Assembly/Reliability,MEMS/RF/MOEMS,Microsystems Packaging / Modular Microsystems,Nanomaterials,Nanotechnology, Materials, & Electronics,New Materials and Processes,Optoelectronics,Plastic 3D PCB to PCB Technology,Power or Thermal Management,Power Electronics,Printed Electronics Technology,Reliability of Nanodevices,Resin Reinforcement Solder Pastes,Sensors and Manufacturing,Smart Manufacturing Systems,Small Die Size Singulation,Solid State Lighting,Solar Technology,System in a Package,Thermal Interface Materials,Touch Screen Technologies,Virtual Prototyping,Wearable Electronics,Wireless Applications

Harsh Environment Applications: (Military, Aerospace, Automotive, Industrial, Oil & Gas):Alternate Energy,Battery Prognostics,Components and Reliability,Copper Corrosion,COTS,High Lead Solder Replacement,High Temperature Electronics,Lead-free Issues,Non-Destructive Inspection,Micro-Computed Tomography,Multiphysics Modeling,Substrates and Finishes,Thermal Management,Tin Whiskers

PCB Technology: Bio-Compatible Substrates,Black Pad and Surface Finish Defects,Conductive Anodic Filament (CAF),Creep Corrosion,Embedded Passive/Active Components,Halogen Free,HDI,High Power PCBs,Micro-vias (including filled/unfilled),Moisture Sensitivity,New Laminate Materials,New Surface Finishes & Solderability,Pad Cratering,Soldermask,Substrate Reliability

Process Control: Acoustic Imaging (C-SAM),Bene-ts of AOI & SPI,CIM,In-Circuit Test,Process Modeling,Software,Test Strategies,2D/3D X-Ray

SMTA China Annual Award Presentation (25 April 2017)

It is a great opportunity to meet with our friends in the SMT Industry at the SMTA China Annual Award Presentation.  In addition, in order to appreciate the speakers of excellent information sharing, SMTA China would like to honor the best paper, and the speaker of best presentation, which award will be presented during the Annual Award Presentation of SMTA China at the venue of vendor conference in the afternnon of 25 April in Shanghai

Enquiry and Registration: E-mail to peggychen@smta.org.cn

Leading Exhibitors

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