SMTA China East Conference 2015

NEPCON China现场技术工作坊  Conference Agenda, Technology Workshop, SMT Engineer Certification ,Rre- Registration, SMTA Award nomination,SMTA China Committee Meetings

SMTA China East Conference 2015



20-23 April 2015
Shanghai World Expo Convention &
Exhibition Center, China

SMTA China East Conference 2015 Program

 
20 April
(Monday)
21 April
(Tuesday)
22 April
(Wednesday)
23 April
(Thursday)

Technology Workshop

09:00-17:00
     

Technology Conference

 
10:15-16:00
   

Vendor Conference

 
10:30-15:30
10:30-12:30

SMT Engineer Certification

 
09:00-17:00

SMTA China Annual Award Presentation

 
15:45-16:15
   

Trade Show

 
NEPCON China 2015

The SMTA China will organize the SMTA China East Conference 2015 in Shanghai on 20-23 April, 2015. This timely event will be held in conjunction with NEPCON China 2015. This events will address the industry’s most pressing issues in electronics assembly/ manufacturing, industry/ technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability

Technology Conference/Vendor Conference Topics (21-23 April 2015)

Topical coverage includes:
Advanced Packaging/ Components: 2.5/3D Packaging and Integration, BGA/CSP, Biomedical Packaging, Bumping, Chip on Board, Copper Wire Bonding, Direct Chip Attach, Embedded and Miniature Passives, Failure Analysis, Fine Lead Pitch, Flip Chip, Hermetic Packaging, High Temperature Packaging, Lead Finishes, Leadless Packages (LGA/QFN/BTC), MEMS and Sensors, Package on Package (PoP), Photonics, Photovoltaics and Solar, Reliability, Through Silicon Vias (TSVs), Tin Whiskers, Wafer Level Packaging (WLP)

Assembly: 01005 Component and Assembly, Adhesives, Alternate Alloys, BGA/CSP Assembly, Cleaning, Conformal Coating and Potting, Connector Technology, DFX/Design for Six Sigma, Dispensing, Equipment Selection, Facility Layout, Flux and Solder, Halogen and Halogen-Free, Head on Pillow Defect/Warpage Induced Solder Joint Defects, High Melting Point Solder, Land Pattern Design, Lead-Free Soldering/Reliability, Lean Manufacturing, Low Temperature Soldering, Low Volume/Prototype, Non-Wet Open Defects, Medical Electronics , Placement, Printing, Reflow Soldering, Rework and Repair of QFNs, RFID Assembly, Selective Soldering, Set Up Reduction, Solder Paste, Solder Voids, Supplier Engineering , Underfill/ Corner Glue/ Other Polymeric Reinforcements, Vapor Phase Reflow, Wave Soldering, Yield Improvement

Business/Supply Chain: Capacity Modeling, Conflict Minerals, Contract Manufacturing, Doing Business in Asia, Environmental Issues, Lean Manufacturing, Onshoring, Operations Management, Remaining , Competitive, RoHS/REACH Compliance, Supplier Management, Technology Roadmaps

Emerging Technologies: Printed Electronics Technology, Embedded Active Technology, Embedded Passive Technology, Nanotechnology, Materials, & Electronics, Reliability of Nanodevices, MEMS/RF/MOEMS , Sensors and Manufacturing, Microsystems Packaging / Modular Microsystems, Advanced Packaging, System in a Package, LED Technology/Assembly/Reliability, Touch Screen Technologies, Solid State Lighting, Optoelectronics, Flexible Electronics, New Materials and Processes, Solar Technology, 0201/01005 Components/Assembly, Consumer Applications , Wireless Applications, Power or Thermal Management, Thermal Interface Materials

Harsh Environment Applications: Alternate Energy, Components and Reliability, Copper Corrosion, Lead-free Issues, Substrates and Finishes, Thermal Management, Tin Whiskers

PCB Technology: Black Pad and Surface Finish Defects, Creep Corrosion, Embedded Passive/Active Components, Halogen Free, HDI, High Power PCBs, Microvias (including filled/unfilled), Moisture Sensitivity, New Laminates, New Surface Finishes, Pad Cratering, Soldermask, Substrate Reliability, Substrate Solderability, Surface Finish

Process Control: Acoustic Imaging (C-SAM), AOI, CIM, In-Circuit Test, Process Modeling, Software, Solder Paste Inspection, Test Strategies, 2D/3D X-Ray

SMT Engineer Certification (21-23 April 2015)

SMTA Engineer Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes. The program concludes on days two and three with an open and closed book examination..

This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes

SMTA China Annual Award Presentation (21 April 2015)

It is a great opportunity to meet with our friends in the SMT Industry at the SMTA China Annual Award Presentation. In addition, in order to appreciate the speakers of excellent information sharing, SMTA China would like to honor the best paper, and the speaker of best presentation, which award will be presented during the Annual Award Presentation of SMTA China at the venue of vendor conference in the afternnon of 21 April in Shanghai .

Enquiry and Registration: E-mail to peggychen@smta.org.cn

  

   

   

   

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Exhibition Hours
Day Time
Tuesday, April 21 09:30-16:30
Wednesday, April 22 09:00-16:30
Thursday, April 23 09:00-16:00

Please send SMS “CNH+Name+Company” to
106900297333 for Visiting Pre-registration of NEPCON China 2015

Visitor Hotline
International Callers:86-21-2231-7011
From within China:400-650-5611 or 86-10-5763-1818

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Featured Exhibitors

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First Technology FUJI
WKKalpha
凯能自动化日东电子科技
http://www.nordson.com/en-us/divisions/yestech/pages/default.aspx技鼎机电

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