Alltemated and pb tec are showing PLACE-N-BOND Underfilm SMT pre-form adhesives at Productronica – pb tec Solutions Booth #A2-421
Underfilm technology uses pre-formed thermoplastic to edge-bond BGA/CSP/LGA and other packages to the PCB. This helps to improve solder ball/joint and shock-drop reliability without the need to dispense from a syringe like traditional underfill. PLACE-N-BONDTM Underfilm comes packaged in Tape and Reel and can be seamlessly integrated on existing SMT assembly lines, where the Underfilm strips can be picked and placed with a custom nozzle.
Traditional underfill can encapsulate the entire gap between the component and PCB, whereas PLACE-N-BONDTM , the alternative underfill solution is ideally placed along the corners of the component as that is a frequent area of stress on solder joints. The edge-bonding and gap-fill occurs during the reflow process; no secondary cure is required. PLACE-N-BONDTM Underfilm can be custom-designed for many applications and has numerous sizes readily available. It’s alternative, Underfill, typically has a shelf life of 2 years and needs to be kept in cold storage, PLACE-N-BONDTM can be stored at room temperature and has a 10-year shelf life. Underfill is not capable of being re-worked; Alltemated’s PLACE-N-BONDTM Underfilm is 100% re-workable.
This product has been fully tested. Drop tests results show a significant improvement in solder joint/ball and shock-drop reliability. PLACE-N-BONDTM Underfilm is RoHS certified and is applied in assemblies using standard lead-free reflow profiles. Alltemated offers the premier underfill alternative solution to with PLACE-N-BONDTM Underfilm
Since 1993, Alltemated has been a leader in the Value-Add service industry. We are an ISO 9001:2008 registered company. Alltemated employs the most efficient and effective methods for services such as IC Programming, Carrier Tape Manufacturing, Tape and Reel and other Assembly Services. Our patented manufactured underfill alternative solution, PLACE-N-BONDTM Underfilm, sets us apart in the market.