Electronic Materials Pavilion

NEPCON China is one of exhibitions focusing on the display of SMT and "electronics manufacturing automation" equipment and technology with outstanding scale in the electronics manufacturing industry. Along with the development of electronics to smallness, lightness, thinness, shortness and multiple functions, people have higher and higher requirements on performance and environmental protection of electronics. Currently, the electronics are rapidly growing towards green and pollution-free environment protection, miniaturization and high density and reliability. Such trend enables constant enhancement for manufacturing process requirements of electronics and also puts forward stricter challenge for diversified electronic materials in each course of production.
Buyers of NEPCON have proposed the purchasing requirements with higher standard and electronic materials shall be more efficient, safe and environment-friendly with low cost while ensuring the success of manufacturing process and reliable quality of products. NEPCON particularly opens a special area for electronic materials in 2016 to meet the purchasing demands of this batch of buyers.
Exhibiton Outline:
Organized by:Reed Exhibitions
Dates: 24-26 April 2019
Venue: Shanghai World Expo Convention & Exhibition Center, China

Exhibition Scope:

Soldering material: solder wire, solder bar, solder paste, solder line, solder ball, flux
Adhesive: SMT patch red adhesive, LED patch silicone, UV adhesive, AB adhesive, cofferdam filling adhesive, under-fill adhesive, sealant, conductive silver colloid, potting silicone, electronic tape, etc.
Cleaning material: cleaning agent
Electronic and metal material: precious metal material, refractory metal material, rare metal material, etc.
Others: three-proofing lacquer, solder oxide reducing agent, antioxidant, surface treating agent, electronic insulation material, electronic chemical material, etc.

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