Electronic Micro-assembly and SiP Process Pavilion

Overview of Pavilion
Dates: 24-26 April 2019
Venue: Shanghai World Expo Convention & Exhibition Center, China
Organizer: China Council for the Promotion of International Trade Electronics & Information Industry Sub-council, Reed Exhibitions
Introduction

NEPCON innovated to create the " Electronic Micro-assembly and SiP Process Pavilion " which, in line with the concept of Packaging + PCBA, serves as a comprehensive professional exhibition platform of electronic micro-assembly, circuit board assembly and finished product assembly that leads the development trend of advanced packaging industry.  The Pavilion will attract core buyers from industries such as wireless communications, automotive electronics, medical electronics, computers, military electronics which have the packaging and testing demand, as well as integrated circuit design enterprises, and electronic product design enterprises.

Scope of Exhibits
Wafer lapping: Grinding & polishing equipment
Wafer cutting: Dicing saw
Dice bonding: Wafer mounter
Solidification & cleaning: Vertical solidification furnace, vacuum reflow welding furnace, plasma cleaning equipment
Bonding: Ball planting machine, wire bonding machine
Sealing: Laser welding equipment, parallel seam welding equipment
Detection: Xenon side leakage, AOI, X-RAY, flying probe tester, microscope
Materials: Gold wire and aluminum wire, substrate, blue film, adhesive, solder tin material
Others: Dispensing, printing, reflow soldering

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Leading Exhibitors

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