Soldering and Dispensing Pavilion

Overview of Pavilion
Dates: 24-26 April 2019
Venue: Shanghai World Expo Convention & Exhibition Center, China
Organizer: China Council for the Promotion of International Trade Electronics & Information Industry Sub-council, Reed Exhibitions

Driven by “Made in China 2025”, the electronics manufacturing industry is gradually entering the era of intelligence and automation. These changes also place higher demands on welding, dispensing and spraying equipment.
NEPCON China sets up the “Soldering and Dispensing Pavilion” to gather famous companies such as BTU, Heller, ERSA, Rehm, Tamura, Electronics Soltec, Unisplendour Suneast, Nordson, JT Automation Equipment, Quick, Musashi, Anda and H&H Technology, display new equipment and new technology at site and provide buyers with more intelligent welding, dispensing and spraying technology options.

Scope of Exhibits
 Wave soldering equipment
 Reflow soldering equipment
 Tin paste/tin wire/tin bar/tin ball
 Glue (red glue/yellow glue/black glue, etc.)
 Solder tip cleaning device/solder tip
 Welding table
 Hot air welding equipment, infrared welding equipment, laser welding equipment, ultrasonic welding equipment, vapor phase soldering equipment
 Welding torch
 Solder joint testing equipment, solder joint reliability test system
 De-soldering system, cleaning equipment and materials
Scope of Exhibits
 Printing equipment
 Mounting equipment
 Packaging equipment
 Component feeding system
 Board loading and unloading machines (board splitting/feeding machine)
 Surface mounting accessories/nozzle/feeder/steel net
 Other SMT technologies and equipment
Exhibition Brand

Quick Links

Leading Exhibitors


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