Surface Mount Technology Pavilion

Overview of Pavilion
Dates: 24-26 April 2019
Venue: Shanghai World Expo Convention & Exhibition Center, China
Organizer: China Council for the Promotion of International Trade Electronics & Information Industry Sub-council, Reed Exhibitions

With the ever-increasing miniaturization and versatility of electronic products and the explosive growth of consumer microelectronic products such as mobile phones and tablets, surface mount technology (SMT) is developing towards high precision and high density, covering a wide range of application fields such as communication electronics, automotive electronics, medical electronics, avionics, wearable equipment and smart home appliances. With the rapid development of 5G and related industries, the electronic manufacturing industry will be revitalized again with unlimited development prospects.
NEPCON China is a professional exhibition that focuses on surface mount equipment and technology in the electronics manufacturing industry. The "SMT P" under NEPCON China which covers patch, printing, packaging, component supply systems, board loading and unloading machines, and SMT-related accessories and brings together well-known brands and innovative products at home and abroad has become a trade platform in the industry.

Scope of Exhibits
 Printing equipment
 Mounting equipment
 Packaging equipment
 Component feeding system
 Board loading and unloading machines (board splitting/feeding machine)
 Surface mounting accessories/nozzle/feeder/steel net
 Other SMT technologies and equipment
Exhibition Brand

Quick Links

Leading Exhibitors


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