Venue/地点 |
Room No.6, B2, Shanghai World Expo Exhibition & Convention Center 上海世博展览馆地下二层6号会议室 |
|
Time/时间 |
Topic/主题 |
Speaker/演讲者 |
10:45 – 11:20 |
Versatile TIM Solution With Chain Network Solder Composit 链状网格焊接复合材料提供的多功能热界面解决方案 (CE21-TC1.1) |
Dr. Sophia Bu 卜秀丽博士 Indium Corporation 铟泰公司 |
11:20 – 11:55 |
Micro-Solutions: Solving One Challenge At A Time 微观解决方案: 一次解决一个问题 (CE21-TC1.2) |
Yunliang Du 杜运亮 Mentor, A Siemens Business |
11:55 – 12:30 |
High-Reliability, Fourth Generation Low-Temperature Solders: Improving Drop Shock Performance 高可靠性第四代低温焊料：改善跌落抗冲击性能 (CE21-TC1.3) |
William Yu 余瑜 MacDermid Alpha Electronics Solutions 麦德美爱法 |
12:30– 13:45 |
Lunch Break / 午餐 |
|
13:45 – 14:20 |
An Alternative Lead-Free Low-Temperature Solder With Excellent Drop Shock Resistance 一种抗跌落性能优异的无铅低温焊料 (CE21-TC1.4) |
Anson Yu 虞沈捷 Indium Corporation 铟泰公司 |
14:20 - 14:55 |
Investigation on the Failure Mechanism of Electrochemical Migration of Printed Circuit Board Under The Soluble Salts In Dust 尘土中可溶性盐作用下的电路板电化学迁移失效机理研究 （CE21-TC1.5） |
Dr. Yilin Zhou 周怡琳博士 School of Artificial Intelligence of Beijing University of Posts and Telecommunications 北京邮电大学人工智能学院 |
14:55 - 15:30 |
Accelerating Continuous Improvement With Next Generation pH Neutral Cleaning Products 新一代pH中性清洗剂推动清洗工艺持续改进 (CE21-TC1.6) |
Jerry Ji 纪建光 ZESTRON North Asia ZESTRON北亚分公司 |
Conference Chairman/会议主席
Wisdom Qu 瞿燕红
Area Technical Manager for Eastern China 技术经理
Indium Corporation(Suzhou)Co., Ltd. 铟泰公司
April 2021 (Wednesday) / 2021年4月21日(星期三)
(CE21-TC1) Technology Conference / 高科技技术研讨会
All papers will be presented in Chinese 所有演讲者都将使用中文
April 2021 (Thursday ) / 2021年4月22日(星期四)
(CE21-TC2) Technology Conference / 高科技技术研讨会
Venue/地点 |
Room No.6, B2, Shanghai World Expo Exhibition & Convention Center 上海世博展览馆地下二层6号会议室 |
|
Time/时间 |
Topic/主题 |
Speaker/演讲者 |
10:45 – 11:20 |
Can Low Cost Silver Free Alloy Be Used In Type II & III Assemblies 低成本无银合金可用于II型和III型组装吗？ (CE21-TC2.1) |
William Yu 余瑜 MacDermid Alpha Electronics Solutions 麦德美爱法 |
11:20 – 11:55 |
The Relationship Between Cleanliness and Reliability/Durability 清洁度与可靠性/耐用性的关系 (CE21-TC2.2) |
Daniel Gao 高伟 Shanghai KYZEN Cleaning Materials Co., Ltd. 上海凯晟清洁材料有限公司 |
11:55 – 12:30 |
Minimizing Voiding In QFN Packages Using Solder Preforms 通过预成型焊片降低QFN空洞 (CE21-TC2.3) |
Leon Rao 饶乐 Indium Corporation 铟泰公司 |
12:30– 13:45 |
Lunch Break / 午餐 |
|
13:45 – 14:20 |
Weak Organic Acids-Detection and Reliability Assesment 弱有机酸-检测和可靠性评估 (CE21-TC2.4) |
Dillon Zhu 朱军桦 AIM Solder |
14:20 - 14:55 |
Can All Liquid Fluxes Work Well On A Reflowed OSP Pad Finish? 所有液态助焊剂都能良好地应用于回流后的OSP焊盘表面吗？ (CE21-TC2.5) |
William Yu 余瑜 MacDermid Alpha Electronics Solutions 麦德美爱法 |
14:55 – 15:30 |
Selective Solder Fine Pitch Components On High Thermal Mass Assembly 选择性焊接高热质量组装的细间距引脚零件 (CE21-TC2.6) |
Binhua Yu 於斌华 ITW Electronics (Suzhou) Co., Ltd. 依工电子设备(苏州)有限公司 |
All papers will be presented in Chinese 所有演讲者都将使用中文