April 24-26, 2024
Shanghai World Expo Exhibition & Convention Center


NEPCON innovated to create the " Electronic Micro-assembly and SiP Process Pavilion " which, in line with the concept of Packaging + PCBA, serves as a comprehensive professional exhibition platform of electronic micro-assembly, circuit board assembly and finished product assembly that leads the development trend of advanced packaging industry.  The Pavilion will attract core buyers from industries such as wireless communications, automotive electronics, medical electronics, computers, military electronics which have the packaging and testing demand, as well as integrated circuit design enterprises, and electronic product design enterprises.


Scope of Exhibits

Wafer lapping: Grinding & polishing equipment

Wafer cutting: Dicing saw

Dice bonding: Wafer mounter

Solidification & cleaning: Vertical solidification furnace, vacuum reflow welding furnace, plasma cleaning equipment

Bonding: Ball planting machine, wire bonding machine

Sealing: Laser welding equipment, parallel seam welding equipment

Detection: Xenon side leakage, AOI, X-RAY, flying probe tester, microscope

Materials: Gold wire and aluminum wire, substrate, blue film, adhesive, solder tin material

Others: Dispensing, printing, reflow soldering