5 Solutions from NEPCON China 2025 to Overcome Precision and Efficiency Challenges

NEPCON China 2025 will be held from April 22–24, 2025, at Shanghai World Expo Exhibition & Convention Center. The show will bring together global suppliers across various critical processes in PCB assembly, including surface mount technology (SMT), testing & measurement, soldering, dispensing, coating, automation, auxiliary equipment and materials, and electrostatic discharge protection, showcasing cutting-edge technologies and innovations.

Booth No.: 1F70

CheckSum 12KN Offline ICT System

KAL will showcase a variety of renowned brands and equipment including:

Cencorp (Finland): Offline depaneling equipment, inline PCB depanelers, and inline laser marking machines
CheckSum (USA): 12KN Offline ICT system
ECD (USA): EV6 reflow oven profiler and monitoring tools
EPV System: EPV5900 full-automatic chip programming equipment
Practical (USA): Model chips and process evaluation kits
PVA (USA): Delta 6 / Delta 8 inline conformal coating and dispensing systems

CheckSum 12KN Offline ICT System Features:

Open test platform suitable for all PCB types
Combines ICT, chip programming, and PFT (parallel functional test) in a single device
Standard dual-stage press bed for isolation and protection during testing and programming
Up to 5,200 test points
Ergonomic sliding fixture for easy operation, no cables required
Supports MDA, powered testing, programming, MultiWriter™ synchronous programming, PFT™, boundary scan, TestJet, and multi-core ICT
CE certified

Booth No.: 1B09

Optical 3D Surface Profiler

Founded in 2003, HGO specializes in microscopic imaging, digital imaging, automated measurement, and customized smart inspection systems. Their products serve sectors such as electronics R&D, telecommunications, IC fabrication, LCD, semiconductor packaging and testing, automotive, new energy, and materials science, as well as academia and metrology institutes.

This optical profiler, based on white light interferometry scanning technology, enables non-contact and highly repeatable 3D surface topography measurement. It delivers both 2D and 3D data characterizing surface quality, ideal for high-precision industries like semiconductors, 3C displays, solar thin films, ultra-precision machining, and nanomaterials.

Booth No.: 1G05

2D-3D Video Microscope EC-S3

Founded in June 2007, EOC is a national high-tech enterprise integrating R&D, production, sales, and services, with over 13 years of experience in optics.

Its EC-S3 video microscope supports 2D/3D vision switching and 360° defect observation, ideal for post-AOI inspections such as cold or false solder joints.

20–160x electronic zoom, flat-surface measurement, and barcode scanning functions
EOC's 3D microscope is a nationally patented product

Booth No.: 1J50

TR7600LL SV 3D AXI (Automatic X-ray Inspection System)

TRI offers one-stop PCB inspection solutions and integrated software (YMS 4.0) supporting Industry 4.0 and smart factory applications. Products include:

3D SPI, 3D AOI, 3D AXI, MDA, ICT systems
YMS 4.0 software for real-time yield monitoring and process optimization

TR7600LL SV Series Highlights:

Enhanced linear scan-based 3D AXI system with up to 20% performance boost over the award-winning TR7600 SIII series
AI-driven algorithms for accurate void detection
7μm resolution for high-yield inspection
EtherCAT motion controller for real-time measurement and easy maintenance
Seamless MES connectivity for smart factories

Booth No.: 1K56

HCAS40072A Automated High-Speed Cable Testing Solution (40GHz, 72 Channels)
Founded in 2014, Hexin Electronics specializes in high-speed interconnect, digital, RF/microwave, and semiconductor testing solutions. Leveraging years of customer-centric experience, the company offers complete solutions including instruments, algorithms, automation software, test fixtures, and cables for fields like AI, computing, 5G, autonomous driving, and satellite communication.

Solution Highlights:

High-speed cable testing system with switch matrix for stable signal and multi-channel expansion
Simultaneous measurement of parameters like impedance, delay, insertion loss per cable pair
Automated switching between cable pairs — no manual rewiring required
Compliant with multiple standard test specifications, customizable TDR & S-parameter settings
Manual/auto modes for flexible production needs
Electrostatic protection design for instrument safety
GPIB interface for broad instrument compatibility
Compatible with various network analyzers
High dynamic range for transient response testing
Rich customization options; supports integration with MES/ERP systems, meeting Industry 4.0 demands

Join us at NEPCON China 2025 April 22-24, 2025, for an unparalleled opportunity to expand your network, engage in direct business matchmaking, and access innovative technologies that will shape the future of electronics manufacturing!

Pre-register for NEPCON China 2025: https://ali2.infosalons.com.cn/reg/NEPCON25SH/registeren/login?type=WE9ZIC

If interested in exhibiting at NEPCON China, please contact

Ms. Julia Gu

Tel: +86 21-2231-7010

Email: [email protected]

If interested in visiting NEPCON China, please contact

Mr. Walden Li

Email: [email protected], [email protected]

Mobile/WhatsApp/WeChat: +86 136-5125-1335

For TAP service, please contact:

Mr. Alan Li

Email: [email protected]