NEPCON
Lufi
Ministry of Industry and Information Technology International Economic and Technical Cooperation Center
Reed Exhibitions
FACTEC CHINA
Brilliant Presentation | Empowering Industries Together, Unveiling Business Opportunities Jointly
NEPCON
Fac Tec
S-FACTORY
June 2-4, 2026
Shanghai World Expo Exhibition & Convention Center
3+1 Initiatives | Target Demand for Optical Modules/Chips/Power Devices
Seize Business Opportunities in AI Servers/AI DC/Liquid Cooling, Automotive Electronics and Integrated Electronic Manufacturing
Scan the QR Code to Register for Exhibition | Secure Orders
With the full release of market demand represented by artificial intelligence and computing power, new data from WSTS shows that the global semiconductor industry is expected to further grow to 975.46 billion US dollars in 2026, a year-on-year increase of 26.3%, hitting a new historical high. In the future, driven by the continuous advancement of large AI models, autonomous driving, Industry 4.0 and the upgrading of consumer electronics, the global semiconductor industry is expected to maintain a steady medium-to-high speed growth.
Meanwhile, market research institute Cignal AI stated in its new report that driven by the construction of AI-powered data centers and transmission networks, the revenue of the optical device market will hit a record high in 2025. From 2024 to 2029, the revenue of the data communication optical module market will grow at a compound annual growth rate of more than 20%, reaching nearly 29 billion US dollars by the end of the forecast period. The report points out that high-speed data communication optical modules, especially 800G and emerging 1.6T products, will continue to be the main driving force for revenue growth in 2026.
Guided by industry trends, NEPCON China 2026 plans to focus on inviting buyer audiences from enterprises engaged in optical modules, chips and power devices, including professionals from management, production and manufacturing, engineering technology, procurement, design and R&D, testing and measurement, automation and other departments. Through supporting activities and business matching for optical modules, chips and power devices, the exhibition will provide efficient docking and communication opportunities for upstream and downstream enterprises in the industrial chain in equipment R&D, capacity layout, equipment procurement and business expansion in the high-end electronic product application market.
This session of NEPCON China 2026 is undergoing transformation and upgrading, and will be held concurrently and at the same venue with S-FACTORY EXPO Smart Factory and Automation Technology Exhibition as well as FAC TEC Electronic Factory Facilities Show, which Reed Exhibitions has laid out in the Japanese market for many years. It will fully present "electronic production equipment", "equipment parts/consumables" and the "end-to-end factory facilities" required by electronic product manufacturing enterprises, creating a one-stop new trade and procurement exhibition platform for the "electronic product manufacturing industrial chain".
Exhibition Inquiries
Ms. Gu Bingrong (Julia Gu)
Tel: +86 21 2231 7010
Email: [email protected]
01 Invited Buyer Enterprises
Optical Modules
Suzhou Zhongji Xuchuang, New Jiesheng, TFO Communication, Accelink Technologies, Hisense Broadband, Huazhong Laser Source, Source Photonics, FiberHome Telecommunication, TP-LINK, netLINK, Netcore Technology, Boyang Communication, keepLINK, Huigu Optoelectronics, DCO Optical Communication, Liaonte Technology, Broadex Technologies, Yuanjie Optoelectronics, Optosigma Technology, Tengjing Technology, Linyun Optics, Taishenguang Technology, Zhongtian Technology, Huamai Technology, Jiulian Technology, Tonyu Communication, Kexin Technology, Zhenyou Technology, Feiyang Communication, Cisco, ZTE Corporation, Cambridge Technology, etc.
Chips (Packaging and Testing Factories, IDM)
JCET Group, Huatian Technology, TFME, Yongxi Electronics, Sencore Semiconductor, Biwin Storage, Jingfang Technology, CR Micro, Hualing Semiconductor, Yangjie Electronics, PT Tech, Amkor Technology, Jingtong Semiconductor, Jimai Microelectronics, Jiejie Microelectronics, Qizhong Technology, Qipai Technology, etc.
Power Devices
CRRC Times Electric, Nexperia, Silan Microelectronics, CR Micro, Yangjie Technology, StarPower Semiconductor, Jiejie Microelectronics, Huajing Microelectronics, BYD Semiconductor, BASiC Semiconductor, Xinyuanneng Semiconductor, Xinjuneng Semiconductor, ZHANXIN Semiconductor, Tech Semiconductor, Raintech Semiconductor, Kaiweite Semiconductor, Nationstar Optoelectronics, Qinghe Jingyuan, Jita Semiconductor, Founder Microelectronics, Huatian Hengxin, Xicheng Semiconductor, Guosheng Electronics, Puxing Electronics, CETC No.55 Research Institute, Tongwei Co., Ltd., Dongni Electronics, Phoenix Optical, Good-Ark Electronics, Dexin Technology, Guolian Wanzhong, Lujing Semiconductor, Ruisen Semiconductor, Qingxin Semiconductor, etc.
EMS&OBM (Including SiP Technology)
Changhong Precision, Delta Electronics, ZF Friedrichshafen, Huawei Technologies, United Automotive Electronics, Gree Electric Appliances, Jiadali Automotive Electronics, Foxconn, Flex, Jabil, Sanmina, Bel Fuse, Inventec, Hongtong Electronics, Quanta Computer, Oulang Group, Luxshare Precision, EVOC Intelligent Technology, Nuot Electronics, BiTD Technology, Universal Scientific Industrial, Shenzhen Kaifa Technology, Lenovo Group, Bosch, Xiangxun Communication, Feiling Cosi, Dell Technologies, Huatai Electronics, Wingtech Technology, Heno Microelectronics, BYD Electronics, United Microelectronics, Longcheer Technology, Huaqin Telecom, Tianlong Mobile, Watowerd Technology, Zhongnuo Communication, MobiWire, ZTE Wingtech, Meige Smart Technology, Quectel Wireless Solutions, Sunwoda Electronic, Desay SV Automotive, etc.
02 Cutting-edge Events, Empowering with Solid Strength
Optical Module Packaging and Testing Technology and Application Conference
Electronic Factory Green and Intelligent Technology Seminar
Special Matching Sessions
Business Tour Groups
Optical Module Packaging and Testing Technology and Application Conference
This conference will focus on the cutting-edge technologies and application trends of optical module packaging and testing, and conduct in-depth discussions on hot topics such as CPO, AI intelligent computing clusters and high-speed interconnection in data centers. It will invite leading enterprises in the industrial chain such as Echeng Technology, Source Photonics and FiberHome Telecommunication to share new breakthroughs in high-speed optical engine packaging, silicon photonics integration, automated testing and other fields.
Electronic Factory Green and Intelligent Technology Seminar
This seminar will interpret in depth the foundation and development trend of green factory construction, focus on the practical paths of clean room environmental control, energy efficiency optimization and intelligent operation and maintenance. It will invite leading semiconductor and home appliance enterprises such as the 11th Design and Research Institute of China Electronics Engineering Group, China Machinery Engineering Corporation No.6 Institute, AMEC, JCET Group, TFME, CR Micro, Midea Group, Hitachi and Hisense to share case studies of the whole life cycle green and intelligent transformation from factory design, construction to operation. The topics cover intelligent lighting, air conditioning system energy saving, manufacturing execution system (MES) integration, etc., providing replicable energy efficiency optimization and intelligent upgrading solutions for the electronic manufacturing industry and helping enterprises achieve low-carbon and high-quality development.
The above events are subject to on-site arrangements.
Data source: China Electronic Components Industry Association, WSTS Report.
Exhibition Inquiries
Ms. Gu Bingrong (Julia Gu)
Tel: +86 21 2231 7010
Email: [email protected]
Visitor Inquiries
Ms. Sun Mei (Summer Sun)
Tel: 400 650 5611, +86 182 3187 0376
Email: [email protected]