June 2-4, 2026
Shanghai World Expo Exhibition & Convention Center

Exhibitor Recommendation: Marco Beijing – Redefining the Industry Standard of Precision Dispensing with "Ultra-Micro & Ultra-Fine" Technology

Fac Tec China Electronic Factory Facilities Exhibition

March 16, 2026 15:01 Guangdong

 

Host & Co-organizer

China Center for International Economic and Technical Cooperation of the Ministry of Industry and Information Technology

RX Reed Exhibitions

 

Fac Tec China 2026

Theme: Uniting Industries · Unlocking Business Opportunities

Venue: Shanghai World Expo Exhibition & Convention Center

Date: June 2-4, 2026

Pre-registration for Visit is in Full Swing! Scan the QR code to register for the exhibition.

 

Concurrent Exhibitions

NEPCON

FACTORY

 

 Company Profile

Since 2014, Marco Beijing has deeply rooted itself in China's dispensing market and occupied an important position in the industry with its piezoelectric jet valves. Aiming at the pain points of traditional valves such as poor viscosity compatibility, limited precision and cumbersome adjustment, we have launched the self-adjusting quick-release double piezoelectric valve and made a breakthrough in EHD ultra-fine dispensing technology. Adhering to the R&D route of "ultra-micro and ultra-fine", we integrate German technology with local innovation, and continue to lead the upgrading of the precision dispensing industry.

 

Booth Number: 1G10

 

 1. Technical Advantages of Self-Adjusting Piezoelectric Valve

1. Automatically adjust the striker stroke, reduce the influence of temperature on glue volume, and ensure the consistency of glue weight.

2. Eliminate spring vibration and achieve a large aspect ratio of glue dots.

 

 2. EHD Dispensing

Electrohydrodynamic Jet Dispensing (EHD) uses a high electric field to control liquids to form micro droplets, achieving precise dispensing at the nanoliter and picoliter levels.

 

Compared with traditional pneumatic or screw dispensing, EHD dispensing has the advantages of high precision and ultra-micro volume dispensing, and is widely used in high-end fields such as microelectronic packaging, biochip manufacturing and flexible electronics.

 

 Technical Advantages

1. Ultra-thin and ultra-fine

2. Line width < 0.20mm

 

 EHD Working Principle

It is composed of calculator control, microscope camera, syringe pump, capillary, substrate, high-voltage power supply and XYZ translation stage. The formation of micro droplets is driven by the combined action of surface tension, gravity + pressure, normal electric stress, tangential electric stress, electric field and electric polarization stress.

 

 3. Product Series & Parameters

 01 Self-Adjusting Double Piezoelectric Jet Valve

 Core Advantages

- Strong compatibility: Adapt to low, medium and high viscosity glues, covering a wider process range.

- Voltage linkage: Precisely set voltage linkage through the controller to flexibly adapt to different glue viscosities.

- Stroke adjustment: Flexibly adjust the striker stroke to effectively eliminate scattered dots and air bubbles and improve dispensing quality.

- High-speed dispensing: The frequency can reach 1000 Hz for low viscosity glues, and stably operate at 500 Hz for high viscosity glues.

- Easy maintenance: Quick-release valve seat design for more efficient daily cleaning and maintenance.

- Ultra-long service life: The service life of piezoelectric ceramics is not less than 1 billion times, stable and reliable.

- High consistency: The difference of glue dots is less than ±1%, ensuring batch stability.

- Excellent aspect ratio: The ratio of glue thickness to glue width exceeds 70%, with full lines and fine forming.

- Micro volume dispensing capacity: Line width as small as 0.24mm, glue dot diameter as small as 0.2mm, and dispensing volume as small as 1nL only.

- Automatic temperature adjustment: Automatically adjust the height of the striker according to the temperature change of the valve body to realize automatic temperature compensation and ensure the consistency of glue weight.

 

 Product Parameters

- Model: stv/ddl/h

- Valve body size (L×D×H): 125mm×62mm×220mm

- Net weight: 0.55Kg

- Max dispensing frequency: 1000Hz

- Min glue dot (line width) diameter: 0.2mm

- Min dispensing volume: 1nL

- Nozzle diameter: 0.04mm-0.40mm

- Striker diameter: 0.50mm; 0.8mm; 1.0mm; 1.5mm; 2.0mm

- Nozzle & striker material: Tungsten steel, diamond, ceramic

- Max heating temperature: 150℃

- Applicable fluid viscosity range: 1-200,000cP

 

 02 Electrohydrodynamic Jet Valve

 Core Advantages

- Strong compatibility: Adapt to low and medium viscosity glues, meeting a variety of application needs.

- Adjustable parameters: Flexibly adjust by configuring electric field intensity to accurately match different glue viscosities.

- High-speed dispensing: Max dispensing frequency up to 5000 Hz, meeting the demand for high-efficiency production.

- Micro volume dispensing: Line width as small as 0.01mm, glue dot diameter as small as 0.005mm, realizing nanoliter-level precision dispensing.

- High consistency: The difference of glue dots is controlled within ±1%, ensuring batch stability.

- Ultra-long service life: Dispensing times up to 10 billion times, durable and reliable.

- Easy maintenance: The ratio of glue width to nozzle aperture is 1:10, not easy to block, and daily maintenance is simple and efficient.

- High fineness: Uniform and full dispensing forming, no scattered dots or glue hanging, suitable for precision process requirements.

- Wide application: Widely used in high-end manufacturing fields such as semiconductor packaging, flexible circuits, precision optics and biomedicine.

 

 Product Parameters

- Model: mev/l01

- Valve body size (L×W×H): 130mm×45mm×210mm

- Net weight: 0.5Kg

- Max dispensing frequency: 5000Hz

- Min glue dot (line width) diameter: 0.005mm

- Min dispensing volume: 1pl

- Glue dot consistency deviation: ±1%

- Nozzle diameter: 0.01mm~0.40mm (optional)

- Nozzle material: Ceramic, glass, metal

- Max heating temperature: 150℃

- Service life: ≥10 billion times

- Applicable fluid viscosity range: 1-5000cp

 

 03 Low Viscosity Jet Valve

 Core Advantages

- Strong compatibility: Adopt lightweight preloaded spring design, specially adapt to low and medium viscosity glues to ensure stable jetting.

- Stroke adjustment: Manually adjust the striker stroke to effectively eliminate scattered dots and air bubbles and improve dispensing quality.

- High-speed dispensing: The dispensing frequency can reach 1000 Hz under low viscosity working conditions, meeting the demand for high-efficiency production.

- Micro volume dispensing: Line width as small as 0.24mm, glue dot diameter as small as 0.2mm, and volume as small as 1nL.

- High consistency: The difference of glue dots is controlled within ±1%, ensuring stable and reliable batches.

- Ultra-long service life: The service life of piezoelectric ceramics is not less than 1 billion times, durable.

- Easy maintenance: Unique valve seat design with quick-release structure for more efficient daily cleaning and maintenance.

- Lightweight design: Compact overall structure and light weight, reducing energy consumption, and more flexible in installation and integration.

- High fineness: Uniform and full glue dots, no scattered dots or glue hanging, especially suitable for precision manufacturing with strict detail requirements.

 

 Product Parameters

- Model: stv/dsl/x

- Valve body size (L×W×H): 90mm×26mm×150mm

- Net weight: 0.3Kg

- Max dispensing frequency: 1000Hz

- Min glue dot (line width) diameter: 0.2mm

- Min dispensing volume: 2-3nl

- Nozzle diameter: 0.04mm-0.40mm

- Striker diameter: 0.50mm; 0.8mm; 1.0mm; 1.5mm; 2.0mm

- Nozzle & striker material: Steel, diamond, ceramic

- Applicable fluid viscosity range: 10-10,000cP

 

 04 High Viscosity Jet Valve

 Core Advantages

- Strong compatibility: Adopt high preload spring design, specially adapt to high viscosity glues and also suitable for medium viscosity applications.

- Stroke adjustment: Manually adjust the striker stroke to ensure smooth jetting of high viscosity glues.

- High-speed dispensing: Stably achieve 1000Hz dispensing frequency under high viscosity working conditions to guarantee production efficiency.

- Strong power: High-force drive design provides sufficient jet energy to ensure clear breakpoints and stable forming of high viscosity glues.

- High consistency: Under complex working conditions, the difference of glue dots is still controlled within ±1%.

- Ultra-long service life: The service life of piezoelectric ceramics is not less than 1 billion times, ensuring long-term stable operation.

- Easy maintenance: Unique valve seat design for easy cleaning and maintenance, even for handling high viscosity glues.

- High fineness: Even under high-force jet conditions, the glue dots remain full and uniform without glue hanging.

- Wide application: Suitable for high viscosity dispensing process scenarios such as electronic packaging and automotive electronics.

 

 Product Parameters

- Model: stv/dsl/h

- Valve body size (L×W×H): 110mm×62mm×220mm

- Net weight: 0.44Kg

- Max dispensing frequency: 1000Hz

- Min glue dot (line width) diameter: 0.2mm

- Min dispensing volume: 2-3nl

- Nozzle diameter: 0.04mm-0.40mm

- Striker diameter: 0.50mm; 0.8mm; 1.0mm; 1.5mm; 2.0mm

- Nozzle & striker material: Tungsten steel, diamond, ceramic

- Max heating temperature: 150℃

- Applicable fluid viscosity range: 5,000-20,000cp

 

 05 Screw Valve

 Core Advantages

- Strong compatibility: Adapt to medium and high viscosity glues, especially suitable for paste or filled materials.

- Stable glue output: Screw rotation drive realizes continuous and uniform glue extrusion without being affected by air pressure fluctuations.

- Precise control: Flexibly control the glue output by adjusting the screw speed to ensure process consistency.

- Micro volume dispensing: Dispensing volume as small as nanoliter level, suitable for high-precision applications.

- High consistency: The error of glue dots or lines is less than ±1%, meeting strict process requirements.

- Wide adaptability: Can handle a variety of materials such as filled glue, conductive glue and structural glue.

- Easy maintenance: Screw components are easy to disassemble and clean, reducing downtime.

- Durable service life: High-strength screw structure design, wear-resistant, suitable for long-term continuous production.

- Wide application: Widely used in electronic packaging, LED dispensing, automotive electronics, structural glue pouring and other fields.

 

 Product Parameters

- Model: msv/dsl/sl

- Valve body size (L×W×H): 53mm×40mm×190mm

- Net weight: 0.5Kg

- Max working frequency: 400 revolutions per minute

- Min glue dot (line width) diameter: 0.2mm

- Min dispensing volume: 2-3nl

- Applicable needle types: Plastic needle, TT bevel needle, high-precision needle

- Glue supply air pressure: 0.01-0.2Mpa

- Applicable fluid viscosity range: 10,000-500,000cP

 

 4. Application Scenarios

1. Hot Melt Glue Dispensing for Mobile Phone Middle Frame

Line width as small as 0.25mm; Aspect ratio >75%; Automatically adjust glue volume according to dispensing path (0.24mm×0.18mm, aspect ratio:75%).

2. Tuffy Glue Dispensing for FPC

Eliminate air bubbles in glue lines; Uniform glue thickness; Thickness: 30 microns.

3. SMT Solder Paste Dispensing

Smooth and round glue dots; Uniform glue dot size.

4. Silver Glue Dispensing for Semiconductor IC Packaging

Smooth and round glue dots; No scattered dots; Uniform glue dot diameter.

5. Epoxy Resin Glue Dispensing for Chip Inductors

Smooth and round, hemispherical glue dots; High consistency of glue dots; No scattered dots; Min dot diameter: <0.2mm.

6. UV Glue Dispensing for FPC of Mobile Phone Screens

No air bubbles in glue lines; Uniform glue thickness; Aspect ratio: <10% (0.305mm×0.028mm).

7. Ink Light-Shielding Dispensing on EHD Lens Sides

Uniform spraying; Good light-shielding effect; Thickness: <10 microns.

8. UV Glue Dispensing for Motor Weight Matching

High specific gravity and high filler glue; Flat spraying with single dot of 0.4mm, min single dot weight of 0.1mg (C=1.230mm, A=0.120mm×2, r=0.196mm); No air bubbles in glue lines; Uniform glue shape; Stable glue weight.

9. Battery Dispensing & High Viscosity UV Glue Sealing

Uniform glue lines; No scattered dots; No air bubbles.

10. Anaerobic Glue Dispensing for Speaker Magnets

Uniform glue lines; No scattered dots.

11. UV Glue Coating for Typec DB Head

Uniform glue thickness; No scattered dots.

 

 5. About Fac Tec China 2026

 Exhibition Positioning

The ideal gateway to the factory of the future, helping to improve efficiency, strengthen safety and achieve sustainable development!

 

A professional exhibition themed with "Advanced Factory Facilities", gathering global innovative forces and presenting cutting-edge solutions for intelligent, flexible and green factory technologies. From semiconductors to automotive electronics, we deeply explore new breakthroughs in intelligent production, factory safety, green factories and sustainable operations.

 

Through immersive experience sessions during the exhibition, including the Future Factory Exhibition Area, Business Strategy Summit, Technical Seminars and Precision Matching Activities, Fac Tec China will become an ideal platform for enterprise transformation and upgrading, helping you optimize operations, connect with industry leaders and accelerate towards a new era of next-generation manufacturing.

 

 Contact Us

Ms. Summer Sun

Tel: 400 650 5611; +86 182 3187 0376

Email: [email protected]

 

 Exhibition Basic Information

- Date: June 2-4, 2026

- Venue: Shanghai World Expo Exhibition & Convention Center

- Pre-registration: Scan the QR code to register for the exhibition

- Booth Booking: In full swing! Scan the QR code to book a booth

- Industry Exchange Group: Scan the QR code to join (Note: Industry + Company + Position); Reply with the keyword "Join Group" for industrial information, selected reports and supply-demand matching.

 

 Concurrent Events

Scan the QR code to register for the events and discuss the green future with industry experts at Shanghai World Expo Exhibition & Convention Center on June 2-4, 2026.