In the past two years, the development of China's integrated circuit industry has made significant progress to the world's attention, in a favorable industrial environment 5G, Iot, AI and other industries have ushered in the spring of rapid development, the rapid development of each industry at the same time led to the rapid growth of the electronics technology industry used behind. For this reason, we will hold the "Semiconductor Packaging Conference" at the same time as NEPCON 2022 to create technical exchange opportunities with industry colleagues for integrated circuits and third-generation semiconductor devices and to focus on the entire line of technology in the form of production lines, combined with market trends to establish an interactive platform for upstream and downstream communication.
This forum, covering the two themes of SiP and advanced packaging and third-generation semiconductor device packaging process, aims to discuss how SIP and advanced packaging and electronic micro-assembly can break through existing technologies/processes, and how to better meet the opportunities and challenges brought by 5G, AI, IoT, and develop China's "core".
