SMTA China will host the SMTA International Forum 2025 on April 23 (Wednesday), featuring distinguished technical experts from SMTA’s U.S. headquarters. The forum will explore cutting-edge chip technologies and their applications. Experts and scholars from various fields are warmly invited to attend and engage in discussions.
Date: Wednesday, April 23, 2025
Speaker:
Dr. Bauer
Dr. Bauer is a renowned speaker in technology, business, and market strategy, actively engaged in multiple international organizations. He has served on the boards of SMTA and IMAPS and was the President of IMAPS from 2001 to 2002. His numerous accolades include:
Dr. Bauer specializes in strategic technology planning, market analysis, and international business development, with a strong focus on medical devices, such as sensors and imaging systems. With extensive experience in medical device design and manufacturing, he provides a well-balanced perspective on technology and real-world applications.
With over 40 years of industry experience, Dr. Bauer has conducted in-depth research in electronic interconnect technologies, packaging, and assembly, covering:
He has also published over 250 academic papers and articles, making significant contributions to the field.
Chiplets: How’d We Get HERE? ！
Abstract:
A review of the history of chiplets as an architectural and technical solution in advanced
electronics design and manufacture sheds light on future directions and challenges. By reviewing
the bumps in the road thus far, we anticipate the hurdles yet to overcome. The presentation
explores several significant technologies as well as business strategies crucial to successful
deployment of modern chiplet opportunities. Specific areas of interest include hybrid bonding,
assembly hierarchy, substrate and chip supply chain, standardization and system level integration.
Modern Marvels – Episode 7Modern electronic systems incorporate a wide range of marvelous technologies. Each technological building block, in turn, embodies impressive innovation, refinement, and scaling. Semantic naming debates – think SOC vs heterogeneous integration—contribute nothing, influencing neither product requirements nor the available technological building blocks. This genealogy focuses on multiple technologies comprising the modern marvel we call heterogeneous integration (SiP, 2.0/2.5/3.0 D, etc.). Substrates, interconnect and architecture, evolving throughout the past 75 years, form the technology families orchestrating the marvels of modern electronics. This review highlights opportunities to apply and reapply learnings and insights from history to today’s challenges
Registration Inquiry
Pre-register by April 22 for free conference admission
Join us at NEPCON China 2025 April 22-24, 2025, for an unparalleled opportunity to expand your network, engage in direct business matchmaking, and access innovative technologies that will shape the future of electronics manufacturing!
Pre-register for NEPCON China 2025: https://ali2.infosalons.com.cn/reg/NEPCON25SH/registeren/login?type=WE9ZIC
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