[Background]
In the world of precision semiconductor packaging, challenges are ever-present. The bending of large-size products quietly erodes the precision of ball placement, and the stringent requirements of the process leave secondary reflow soldering off-limits. The barriers between equipment flux and ball placement fixtures further constrain production flexibility. These aren't just technical hurdles—they represent an invisible battle between efficiency and quality. Every tiny deviation can become an obstacle to breakthroughs. We understand that only by confronting these pain points head-on can we truly drive progress in the industry.
[Product Positioning]
ECELENT focus on innovation and breakthroughs. Our self-developed SHB-220 multi-axis hybrid ball diameter placement system, the first high-precision semiconductor packaging equipment in China, integrates dual-position synchronous operation, ultra-high precision positioning, and intelligent closed-loop control. It effectively addresses the technical bottlenecks of traditional single-head ball placement systems, filling the gap in China's high-end ball placement equipment market. It provides efficient and precise solutions for the chip and advanced packaging sectors.
