Logic Automation established in 2014, has been dedicated to the R&D, manufacturing, sales, and after-sales service of fully automatic auxiliary material placement machines since its inception.

Focused on excelling in a single category of equipment and serving long-term clients, the company invests heavily in recruiting top industry talent and sourcing high-quality materials. With a commitment to innovation and a steady approach, Logic Automation delivers machines that offer exceptional precision and stability.

With proven expertise in industries such as notebook manufacturing, smartphone production, automotive electronics, FPC, PCB, and 3C products, Logic Automation has developed a number of patented technologies and has earned the trust of leading industry players.

Product Highlights

Fully Automatic Vision Odd-Form Placement Machine – Model: F122Y

Applications

• PCB (Printed Circuit Boards)
• FPC (Flexible Printed Circuits)
• Mid-frames, back covers, and structural components
• Camera lens modules

Key Features

1. Wide Application Range:
   Suitable for auxiliary material placement in PCB, FPC, and related industries. Supported materials include PI, conductive adhesives, double-sided tapes, thermal pads, graphite heat dissipation films, labels, protective films, high-temperature tapes, texture films, explosion-proof films, etc.

1. High-Speed Placement:
   Dual-Y axis structure with linear motors and high-precision grating rulers enables fast and precise placement. Max speed: 0.8s/PCS.
2. Excellent Precision & Stability:
   Each machine undergoes laser interferometer calibration to ensure an accuracy of ±0.075mm upon delivery.
3. Smart Control System:
   In-house developed software with Industry 4.0-ready intelligent guided interface; simple and efficient programming.
4. Intelligent Placement:
   Defective spots can be scanned and skipped intelligently, reducing auxiliary material waste.

Fully Automatic Auxiliary Material Placement Machine – Model: T2D

Applications
Ideal for the placement of auxiliary materials on:

• PCB, FPC
• Smartphone mid-frames, back covers, motherboards, lenses
• Laptop motherboards, outer shells
• Brackets, metal components, chips, electronic parts

Supported materials: pressure-sensitive adhesives, PI, conductive adhesives, double-sided tapes, thermal gels, graphite sheets, shielding covers, labels, protective films, ring foams, conductive foams, high-temp tapes, texture films, explosion-proof films, etc.

Key Features

1. Wide Material Compatibility:
   Supports multiple materials and application scenarios.

1. High-Speed & Multi-Material Placement:
   Equipped with 4 independently controlled placement heads (Z and rotation), supporting simultaneous placement of up to four different materials.
2. High Precision Build:
   Reinforced high-precision steel frame and granite beam ensure long-term stable production. Calibrated using laser interferometers for delivery accuracy of ±0.05mm.
3. Smart Control + MES Ready:
   Self-developed software optimized for Industry 4.0. Intuitive operation system plus optional MES integration module.

Fully Automatic Shielding Cover Placement Machine

Key Features

1. High Speed & Precision:
   Designed for fast and accurate placement of shielding covers. Each unit can mount multiple covers per minute, greatly enhancing productivity.
2. Fully Automated Operation:
   Integrated feeding, pick-and-place, and capping process ensures smooth, fully automated production.
3. High Stability:
   Ensures consistent production quality.
4. High Throughput:
   Optimized for high-volume manufacturing environments.

Fully Automatic Online Label Printing & Placement Machine

Key Features

1. Strong Flexibility:
   Rapid label template switching and easy adjustment of placement parameters allow adaptation to various product types, label contents, and placement positions.
2. Precision & Consistency:
   Equipped with advanced sensors and control systems for precise printing and placement, minimizing misalignment and ensuring consistent product appearance.
3. Enhanced Efficiency:
   Integrates printing and labeling in one process, eliminating manual steps and significantly boosting efficiency.
4. Configurable Setup:
   Includes one feeder + one label printer. Feeder accommodates a wide range of material sizes with simple baffle adjustments; output length automatically adjusts per production program.
5. Label Size Range:
   Supports material sizes from 2mm × 2mm to 100mm × 40mm; online label printing supports labels as small as 6mm × 6mm.

Fully Automatic De-paneling & Placement Station

Key Features

• Self-developed intuitive control software
• Automatic carrier loading, compatible with various board loaders
• Automatic tray recycling system
• Supports FPC magnetic and adhesive jig processes
• Compatible with glue dispensers, printers, and other auxiliary machines

Placement Quality Assurance System

Pre-Placement Inspection:

• Prevents duplicate placement
• Detects missed or misaligned placements from upstream processes

Post-Placement Inspection:

• Ensures no missing, misaligned, or duplicate placements
• Effectively blocks defective products from progressing to the next stage

Join us at NEPCON China 2025 April 22-24, 2025, for an unparalleled opportunity to expand your network, engage in direct business matchmaking, and access innovative technologies that will shape the future of electronics manufacturing!

Pre-register for NEPCON China 2025: https://ali2.infosalons.com.cn/reg/NEPCON25SH/registeren/login?type=WE9ZIC

If interested in exhibiting at NEPCON China, please contact

Ms. Julia Gu

Tel: +86 21-2231-7010

Email: [email protected] 

If interested in visiting NEPCON China, please contact

Mr. Walden Li

Email:  [email protected], [email protected]  

Mobile/WhatsApp/WeChat:  +86 136-5125-1335

For TAP service, please contact:

Mr. Alan Li

Email: [email protected]

For media partnerships, please contact:

Ms. Yuri Yu 

E-mail: [email protected]，[email protected]  

Ms. Chopin Mo 

E-mail: [email protected]

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