Cutting-Edge Equipment Debut at the Semiconductor Packaging & Testing Process Demonstration Line at NEPCON China 2025

NEPCON China 2025 will be held alongside ICPF 2025 from April 22 to 24 at the Shanghai World Expo Exhibition & Convention Center. This upgraded edition will feature a live demonstration line showcasing key semiconductor packaging and testing processes, including advanced packaging, SiC die attach and silver sintering, IGBT die attach with solder preforms, wire bonding, and inspection. The exhibition will bring together 50 leading brands in semiconductor packaging and testing equipment and materials, empowering enterprises to drive industrial transformation and technological advancement.

Fully Automatic Nano Silver/Nano Copper Positive Pressure Sintering Furnace — SIN270

Works with R&S network analyzers for rapid impedance and S-parameter measurement in PCB mass production
Auto waveform adjustment, no manual intervention required
EXCEL data reporting and real-time waveform image storage and data upload
Measurement speed: 0.5 seconds per point (single parameter)
Ethernet communication for simple and efficient operation
Supports full automation when integrated with a high-frequency switch matrix system
Compatible with WIN7/WIN10/WIN11 operating systems
Customizable testing functions and MES system integration support

Fully Automatic Heavy Wire Bonder — TAURUS

Taurus is an independently developed heavy wire bonder by SJ Automation, designed for applications in new energy vehicles, electric bicycles, wind/solar power generation and storage modules, and lithium battery systems.

It features a fully self-developed dual-drive, dual-feedback gantry system, high-power transducers, and advanced motion control technology, ensuring welding stability and bond consistency.

Ultrasonic Scanning Acoustic Microscope — GRD-CS3

The GRD-CS3 Ultrasonic Scanning Microscope is a non-destructive testing tool that displays data in waveforms and images. It uses high-frequency ultrasound (above 5 MHz) to detect internal defects, such as voids, cracks, inclusions, and delaminations. It is especially sensitive to bonding layers and retains fine defects that destructive testing may miss. Samples can be reused after inspection.

Main applications: failure analysis, reliability testing, process control, quality control, R&D, and process improvement.

Formic Acid Vacuum Reflow System — TFV-300

THERLICON’s formic acid vacuum furnace enables soldering between chips and substrates, heat sinks and boards, or lids and enclosures. Smaller voids in joints result in higher thermal conductivity, lower resistance, faster heat transfer, and greater reliability.

Features:

Compatible with solder paste or preform; uses hot plate contact heating up to 400°C
Each chamber’s cooling water flow and temperature are independently monitored and controlled
Accurate pressure control ≤1 mbar; void rate inside solder joints ≤1%
Precise gas flow control; supports fluxless soldering with nitrogen, forming gas, or nitrogen/formic acid mix

Multi-Chip Hybrid Placement Machine — CPM-FS10

Enhanced Reliability and Load Capacity: Fewer interface devices improve system reliability and allow heavier load handling
Flexible Feeder Module: Modular design with standard ports for plug-and-play adaptability
High-End Hardware and Craftsmanship: Ensures product quality and system stability
Diverse Configurations: Multiple high-end options available to meet various client needs
Applications: Suitable for IGBT, IPM, and other module production processes across multiple industries

Fully Automatic High-Speed Jet Bumping Machine — HS-M2

Enhanced Reliability and Load Capacity: Optimized for stability and higher payloads
Flexible Feeder Module: Easily reconfigurable for various production needs
Top-Tier Hardware & Craftsmanship: Built with advanced components and assembly techniques
Full-Line Jet Bumping Solutions: Proprietary technology covering 2.5D, 3D, and Chiplet packaging; integrates automatic feeding, jet bumping, rework, and unloading in one line
Quick Product Changeover: Simplifies operation and reduces labor cost
Non-Contact Jet Bumping: World’s first of its kind, speeds up to 80–300 bumps/sec; ideal for warped substrates and flexible low-volume production
No Mold Required: Eliminates mold development cost and time
Applications: Widely applicable to IGBT, IPM module processes and more

Join us at NEPCON China 2025 April 22-24, 2025, for an unparalleled opportunity to expand your network, engage in direct business matchmaking, and access innovative technologies that will shape the future of electronics manufacturing!

Pre-register for NEPCON China 2025: https://ali2.infosalons.com.cn/reg/NEPCON25SH/registeren/login?type=WE9ZIC

If interested in exhibiting at NEPCON China, please contact

Ms. Julia Gu

Tel: +86 21-2231-7010

Email: [email protected]

If interested in visiting NEPCON China, please contact

Mr. Walden Li

Email: [email protected], [email protected]

Mobile/WhatsApp/WeChat: +86 136-5125-1335

For TAP service, please contact:

Mr. Alan Li

Email: [email protected]